The 2025 Munich Shanghai Electronics Show of Anxin Group came to a successful conclusion

On April 15th, the 2025 Munich Shanghai Electronics Show officially kicked off at the Shanghai New International Expo Center. As one of the world's most influential electronics industry events, this exhibition has attracted over 1,800 high-quality enterprises from all over the world to participate, covering multiple product fields such as semiconductor integrated circuits, discrete devices, intelligent control, and sensors. As a well-known IDM manufacturer in the domestic semiconductor discrete device field, Anxin Group showcased its latest products at booth 525 in Hall N4, becoming one of the key exhibitors at this exhibition.

 

 

At this exhibition, Anxin Group highlighted its latest developed DO-218 series of automotive-grade TVS products, ultra-low forward voltage drop (VF) bridge rectifiers, the world's first SMC-packaged load drop TVS (transient voltage suppressor), and the third-generation semiconductor SiC series products, empowering core fields such as automotive electronics, industrial power supplies, and new energy with innovative technologies. It has drawn high attention from the industry.

DO-218 series Load Dump high-power automotive-grade TVS products: Safeguarding the automotive industry

The DO-218 series Load Dump high-power automotive-grade TVS products are one of the classic packages for automotive electronics applications. They have the advantages of ‌ high heat dissipation, mechanical shock resistance and extreme temperature resistance, especially in the Load Dump throw load transient surge test. It is commonly used in the lighting systems of passenger and commercial vehicles as well as for voltage transient protection caused by inductive loads. It plays a significant role in the circuit protection, power management and signal processing of automobiles, and helps to enhance the stability, reliability and safety of automotive electronic systems.

The mainstream chip processes in the DO-218 product industry include three types:

GPP：The glass passivation process chip has a relatively simple process and a relatively low cost, with a Tjmax of around 150℃；

OJ-PI glue：The chip adopts OJ process + single-layer passivation protection with PI adhesive. The stress of the chip is relatively low, and the chip area used is large. The IPP performance is improved by relying on the chip area. However, the cleanliness of the PN junction after cleaning is difficult to guarantee. The single-layer PI passivation protection is adopted, and the moisture resistance is relatively weak, which needs to be further verified by the market.

PAR：Developed by Company V, it is currently the most advanced chip structure design in this product series. It adopts three-layer passivation protection, has the strongest reliability, the least stress, the strongest high-temperature resistance, and can reach TJ175℃. Due to SiN protection, it has the strongest high-temperature and high-humidity resistance, the strongest load capacity for the same chip area, and is the most widely used and has the longest application history among Tier 1 manufacturers. And the chip structure is lead-free.

Anxin Electronics has the most in-depth technical research in the industry on DO-218 products. There are benchmark products for all three types of chip processes for customers to choose from, and it can recommend the best product solutions based on different application scenarios of customers.

 

Ultra-low VF bridge rectifier: Redefining efficient energy conversion

In response to the strict energy efficiency requirements of new energy and high-density power supply systems, Anxin Group has launched an ultra-low VF bridge rectifier, which reduces the forward voltage to the industry-leading level by optimizing material processes and structural designs. Compared with traditional products, this device reduces the conduction loss by more than 30% under the same current, significantly improving the overall system efficiency. At the same time, it reduces heat generation, providing more efficient and reliable solutions for scenarios such as electric vehicle charging piles, photovoltaic inverters, and industrial power supplies. Its compact packaging design further meets the layout requirements of high-density circuits, helping customers achieve the dual goals of product miniaturization and performance upgrade.

The load of SMC packaging suddenly drops to TVS: Innovative structure empowers ultimate protection

Anxin's newly launched all-copper frame SMC packaged load drop TVS (Transient Voltage Suppressor), with its breakthrough packaging technology and outstanding performance, targets high-reliability scenarios such as new energy vehicles, industrial power supplies, and communication equipment, providing a brand-new solution for transient voltage impulse protection and demonstrating the hard-core strength of domestic semiconductor technology.

 

 

Under the global energy transition and the wave of intelligence, the performance and reliability of semiconductor devices have become the core driving force for industrial upgrading. The ultra-low VF rectifiers and SMC packaged TVS on display this time are the results of Anxin Group's in-depth exploration of power semiconductor technology and precise understanding of customer needs. We are committed to continuous innovation and focus on providing high-performance and highly reliable solutions for fields such as new energy, automotive electronics, industrial automation and consumer electronics.

The third-generation semiconductor SiC series products: Facilitating the energy revolution

In response to the urgent demand for high-efficiency and high-power-density devices in the new energy industry, Anxin has delved deeply into research and development, overcome the challenges of mass production of third-generation semiconductors, and successfully applied them in fields such as new energy vehicles. This technological breakthrough marks a crucial step for domestic semiconductor enterprises in the industrialization process of new-generation materials, providing solid support for global energy transition and efficient power management.

The Shanghai Munich Exhibition has come to a successful conclusion this time, but Anxin Group will never stop. We will continuously enhance our innovation capabilities and provide better products to safeguard multiple industries such as automotive electronics, industrial power supplies, communication equipment, and high-end consumer electronics!

"China's Anxin, the world's peace of mind!"

Where there is semiconductor, there is Anxin!