Consumer Electronics Applications

Compared with silicon semiconductor, compound semiconductor has excellent performance such as high frequency and high power, and is an irreplaceable core technology for future 5G communication. The Chinese market is a large mobile communication market, and 5G communication will soon be commercialized, which is expected to improve the competitiveness of the compound semiconductor industry on the basis of new market opportunities. The development of domestic compound semiconductors and 5G communication chips is facing a rare window period, and opportunities and challenges coexist.

In order to better promote industry exchanges and provide a platform for domestic excellent compound semiconductor and 5G communication chip enterprises to connect resources with local governments, investment companies and technical experts, the China Institute of Electronics and Information Industry Development will organize a 5G communication chip theme forum during the 2018 China Integrated Circuit Industry Promotion Conference. Invite many national investment institutions, upstream and downstream enterprises and technical experts, including Qorvo, to discuss the development path of China's 5G communication chips from multiple levels such as policy, investment, technology, and industry.

China Electronics and Information Industry Development Institute will hold the 2018 China Integrated Circuit Industry Promotion Conference (China Core Conference) in Nanping International Convention and Exhibition Center on November 9. The conference has been held for 12 consecutive sessions, is one of the influential and authoritative industry conferences in the field of domestic integrated circuits, and is a great review and vane of domestic integrated circuit product innovation and application innovation. The theme of this meeting is "Core era, core as", and exchanges are carried out around establishing a new image of "China Core" enterprises.

 Compound Semiconductors & 5G Communication

5G smartphones will make extensive use of GaAs RF devices. With the continuous increase of mobile communication frequency, Si devices can not meet the performance requirements, and the power amplifiers in 4G smart phones have all adopted GaAs technology. The communication frequency bands supported by 5G communication will be significantly increased to more than 50, far more than the number of frequency bands for 4G communication (no more than 20). To ensure the quality of communication, it is necessary to increase the number of amplifiers or improve the integration of devices. Ccid expects the GaAs device market to reach $10 billion by 2020.

5G communication base stations are in urgent need of GaN RF devices with higher performance. GaN RF power amplifiers combine the high power of Si devices with the high frequency characteristics of GaAs devices. In order to deal with the low efficiency of Si devices in bands above 2.4 GHz, 4G communication base stations began to use GaN power amplifiers. Currently, about 10% of base stations use GaN technology. About 1.5 million new base stations are built globally each year, and future 5G networks will complement smaller, more densely distributed micro-base stations. Ccid expects the GaN RF device market to exceed $600 million in 2020.

Developed countries have completed the strategic layout of compound semiconductors. In the early 21st century, the United States and Europe began to organize technical and industrial support projects, cultivate a number of leading enterprises, and occupy the high ground of technology and market. Since 2002, the U.S. Department of Defense DARPA has released the Wide Band Gap Compound Semiconductor Technology Innovation Program (WBGSTI) and the NEXT Generation GaN Electronic Device Program (NEXT), which has helped Qorvo and other compound semiconductor companies rapidly grow into industry leaders.

In terms of manufacturing maturity, Qorvo has shipped more than 2.6 million GaN devices since 2008, 170,000 of which are used in radar applications. Qorvo's GaN products have each achieved the U.S. Department of Defense's Manufacturing Maturity Assessment (MRL) Level 9.